¡Ý ¹ÝµµÃ¼ : BGA, QFT, TBGA, FBGA, SOP, FET, MLCC, PCB
¡Ý »ê¾÷¿ë : ITO Target, Wafer, Pipe, Plate, Bar, º¹ÇÕ¼ÒÀç, ÇǽºÅæ°Ë»ç, µµ±Ý°áÇÔÆǺ°, ¿ëÁ¢ºÎ
¡Ý ÇÕ¸®ÀûÀÎ °¡°ÝÀ¸·Î ¼³°èµÈ ÃÖ¼ÒÇü SAM Àåºñ.
¡Ý Ç¥¸é ¹× ³»ºÎ °áÇÔ(Debonding, Delamination, Crack) Å©±â, À§Ä¡ ¹× ¼ÒÀçÀÇ µÎ²² ÃøÁ¤.
¡Ý °íÇ°ÁúÀÇ ½ºÄ³´× À̹ÌÁö
¡Ý MINITM EMC¿Í ICÆÐÅ°Áö °Ë»ç¿¡ ÀûÇÕ
¡Ý A, C, T Scan
1. Ultrasonic Pulser/Receiver |
Frequency Range : 1 - 150MHz |
Enough frequency bandwidth to inspect the most of IC’s packages with EMC. |
2. A/D Converter |
Real time 1GHz Sampling Rate, 8bits |
3. Mechanical Scanner |
Scan Axis (Linear servo motor) |
Max. Speed 750mm/s Repeatability +/-1 micron Encoder Resolution 0.5 micron |
Index Axis |
Micro-stepping motor with lead screw, Step Resolution 1 micron |
Vertical Axis |
Micro-stepping motor with lead screw, Max. Stroke 80mm, Step Resolution 1 micron |
4. General |
|
Immersion Tank Dimension |
430mm X 410mm X 90 |
C- Scanning Area with T-Scan |
C-Scan : 350mm X 170mm X 80mm
T-Scan : 350mm X 130mm X 80mm
|
Main Unit SIZE |
720mm X 740mm X 490mm |
Weight |
Approx. 80kg |
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